V-Tec C5-AT25/D4 Manual do Utilizador Página 2

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MAX8520/MAX8521
Smallest TEC Power Drivers for
Optical Modules
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
DD
to GND..............................................................-0.3V to +6V
SHDN, MAXV, MAXIP, MAXIN,
CTLI to GND .........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to GND...............................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to V
DD
...........................................-0.3V to +0.3V
PGND1, PGND2 to GND .......................................-0.3V to +0.3V
COMP, REF, ITEC Short to GND ...................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
Continuous Power Dissipation (T
A
= +70°C)
20-Pin 5mm x 5mm x 0.9mm QFN (derate 20.8mW/°C
above +70°C) (Note 2)...................................................1.67W
3mm x 3mm UCSP (derate 22mW/°C
above +70°C).................................................................1.75W
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering 10s) ..................................+300°C
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
1 = PV
DD
2 = SHDN = 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
T
A
= 0°C to +85°C, unless otherwise noted. Typical values at T
A
= +25°C.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Input Supply Range V
DD
3.0 5.5 V
Maximum TEC Current
±1.5
A
Reference Voltage V
REF
V
DD
= 3V to 5.5V, I
REF
= 150µA
1.485
1.5
1.515
V
Reference Load Regulation V
REF
V
DD
= 3V to 5V, I
REF
= 10µA to 1mA 1.2 5.0 mV
V
MAXI_
= V
REF
140 150
160
V
DD
= 5V
V
MAXI_
= V
REF
/3 40 50 60
V
MAXI_
= V
REF
143 150
155
MAXIP/MAXIN Threshold
Accuracy
V
DD
= 3V
V
MAXI_
= V
REF
/3 45 50 55
mV
V
DD
= 5V, I = 0.2A
0.09 0.14
NFET On-Resistance
R
DS
ON-N
V
DD
= 3V, I = 0.2A
0.11 0.16
V
DD
= 5V, I = 0.2A
0.14 0.23
PFET On-Resistance
R
DS
ON-P
V
DD
= 3V, I = 0.2A
0.17 0.30
V
LX
= V
DD
= 5V, T
A
= +25°C
0.03
4
NFET Leakage I
LEAK(N)
V
LX
= V
DD
= 5V, T
A
= +85°C 0.3
µA
V
LX
= 0, T
A
= +25°C
0.03
4
PFET Leakage I
LEAK(P)
V
LX
= 0, T
A
= +85°C 0.3
µA
500kHz mode 11 14
V
COMP
= V
REF
=
1.500V, V
DD
= 5V
1MHz mode 16 21
500kHz mode 8 11
No-Load Supply Current
I
DD(NO
LOAD)
V
COMP
= V
REF
=
1.500V, V
DD
= 3.3V
1MHz mode 11 14
mA
Shutdown Supply Current I
DD-SD
SHDN = GND, V
DD
= 5V (Note 4) 2 3 mA
Thermal Shutdown
T
SHUTDOWN
Hysteresis = 15°C
+165
°C
V
DD
rising
2.50 2.65 2.80
UVLO Threshold V
UVLO
V
DD
falling
2.40 2.55 2.70
V
Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to exceed
the ICs package power dissipation limits.
Note 2: Solder underside metal slug to PC board ground plane.
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