
Si2400
6 Rev. 1.3
Table 3. DC Characteristics
1
(V
D
= 4.75 to 5.25 V, T
A
= 0 to 70°C for K-Grade, T
A
= –40 to 85°C for B-Grade)
Parameter Symbol Test Condition Min Typ Max Unit
High Level Input Voltage V
IH
2.1 — — V
Low Level Input Voltage V
IL
——0.8V
High Level Output Voltage V
OH
I
O
=–2mA 2.4 — — V
Low Level Output Voltage V
OL
I
O
=2mA — — 0.4 V
Low Level Output Voltage, GPIO1–4 V
OL
I
O
=20mA — — 0.6 V
Input Leakage Current I
L
–10 — 10 µA
CTS Leakage to Ground
2
I
CL
—10—µA
Power Supply Current, Digital
3
I
D
V
D
pin — 28 32 mA
Power Supply Current, DSP Power Down
3
I
D
V
D
pin — 16 19 mA
Power Supply Current, Wake-On-Ring (ATZ) I
D
V
D
pin — 10 11 mA
Power Supply Current, Total Power Down I
D
V
D
pin — 12 15 µA
1. Measurements are taken with inputs at rails and no loads on outputs.
2. Must be met in order to avoid putting the Si2400 into factory test mode.
3. Specifications assume SE1[7:6] (MCKR) = 00
b
(default). Typical value is 4 mA lower when MCKR = 01b and 6 mA
lower when MCKR
= 10
b
.
Table 4. DC Characteristics
1
(V
D
= 3.0 to 3.6 V, T
A
= 0 to 70°C for K-Grade, T
A
= –40 to 85°C for B-Grade)
Parameter Symbol Test Condition Min Typ Max Unit
High Level Input Voltage V
IH
2.1 — — V
Low Level Input Voltage V
IL
——0.8V
High Level Output Voltage V
OH
I
O
= –2 mA 2.4 — — V
Low Level Output Voltage V
OL
I
O
= 2 mA — — 0.35 V
Low Level Output Voltage, GPIO1–4 V
OL
I
O
= 15 mA — — 0.6 V
Input Leakage Current I
L
–10 — 10 µA
CTS Leakage to Ground
2
I
CL
—3—µA
Power Supply Current, Digital
3
I
D
V
D
pin — 15 21 mA
Power Supply Current, DSP Power Down
3
I
D
V
D
pin — 9 14 mA
Power Supply Current, Wake-On-Ring I
D
V
D
pin — 5 8 mA
Power Supply Current, Total Power Down I
D
V
D
pin — 10 12 µA
1. Measurements are taken with inputs at rails and no loads on outputs.
2. Must be met in order to avoid putting the Si2400 into factory test mode.
3. Specifications assume SE1[7:6] (MCKR)
= 00
b
(default). Typical value is 4 mA lower when MCKR = 01
b
and 6 mA
lower when MCKR = 10
b
.
Comentários a estes Manuais